After AMD revealed the details about its upcoming CPU manufacturing architectures last week, Intel took the stage at the 2022 IEEE VLSI Symposium to share some key details about its upcoming Intel 4 process node. The Redmond giant also unveiled an image of an unreleased Meteor Lake compute die at the event. Check out the details below right now!
Intel has claimed that the new Intel 4 or “I4” process node, which will replace its Intel 7 node, offers a 21.5% higher frequencies while consuming the same amount of power or a 40% power reduction while delivering the same frequency as compared to its predecessor. The company also says that it has achieved 2x area scaling improvement with the new technique. This means that the company was able to double the transistor density for the high-performance libraries.
Other than this, Intel shared an image (attached below) of a Meteor Lake compute die with Intel 4 process node and 3D Foveros packaging technology. Although we have seen the Foveros packaging tech used in the company’s Lakefield processors, this will be the first time that Intel is expected to use it for high-volume manufacturing using this packaging technology.
Other details regarding the upcoming Meteor Lake processors are currently scarce. However, much like Alder Lake processors, the upcoming Meteor Lake CPUs are expected to come with an x86 hybrid architecture. There will be six performance cores and eight efficiency cores. As per Intel, the Meteor Lake is on track for a 2023 launch, though an exact release timeline is not provided as of now.
