The much-awaited smartphone exhibition, IFA 2019, is right around the corner. Phone makers have started teasing the new devices they will launch in Berlin, Germany at the event. After LG and Nokia, Huawei has now confirmed its presence at the event and revealed that it will unveil the next iteration of its flagship chipset, the HiSilicon Kirin 990.
The teaser video above doesn’t give away any of the features of the Kirin 990, except for the fact that the chipset may come integrated with a 5G modem. Yeah, most of the chipsets we have seen support 5G in 2019 are ones where a standard modem is replaced with a 5G one. Kirin 990 may support 5G out-of-the-box, integrated with the chipset and that’s great.
As is always the case, Huawei’s new Mate flagship will be the first smartphone from the company to be powered by the Kirin 990 chipset. So, Huawei Mate 30 Pro will launch in September with this chipset in tow, possibly along with their Mate X foldable, which has recently also been rumored to be powered by the Kirin 990.
